Electrical connection element and correspond method and apparatus with outgassing grooves that remove trapped gasses
AssigneeInfineon Technologies AG
InventorsSuhaimi Azizan, Melvin Levardo, Milad Mostofizadeh
Life of this patent
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Abstract
A electrical connection element includes a planar mating surface adapted for mating with a metal bonding surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end.
Claims22
An electrical connection element, comprising:
- a planar mating surface adapted for mating with a conductive bonding surface;
- a rim that forms an enclosed shape around the planar mating surface;
- and
- a plurality of outgassing grooves formed in the planar mating surface,
- wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and
- wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end.
A method of forming an electrical connection in a semiconductor device, the method comprising:
- providing an electrical connection element that comprises a planar mating surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end;
- providing an assembly of a semiconductor die mounted on a die pad with a bond pad of the semiconductor die facing away from the die pad;
- applying a region of solder material to the bond pad;
- arranging the planar mating surface of the electrical connection element on the region of solder material;
- and
- performing a solder reflow step that reflows the region of solder material to form a soldered joint between the bond pad and the electrical connection element.
A semiconductor package, comprising:
- a semiconductor die mounted on a die pad with a bond pad of the semiconductor die facing away from the die pad;
- a electrical connection element that comprises a planar mating surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end;
- and
- a soldered joint between the planar mating surface of the electrical connection element and the bond pad of the semiconductor die.
Dependencies are inferred from the claim text.