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US 9,177,945 B2Granted
Packaged semiconductor device having multilevel leadframes configured as modules
AssigneeTexas Instruments Incorporated
InventorRichard J. Saye
Life of this patent
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Abstract
Fabricating a packaged semiconductor device provides first planar leadframe with first leads and pads having attached electronic components. The first leadframe has a set of elongated leads bent at an angle away from the plane of the first leadframe. A second planar leadframe has second leads having attached electronic components. The bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes.
Claims5
A method for fabricating a packaged semiconductor device comprising:
- providing a first planar leadframe with electronic components assembled on the leadframe pads, the first leadframe including a first set of elongated leads bent in a first direction away from the plane of the first leadframe;
- providing a second planar leadframe with electronic components assembled on the leadframe pads;
- aligning the assembled first leadframe with the assembled second leadframe to bring the bent elongated first set leads of the first leadframe into touch with the second leadframe;
- and
- conductively connecting the elongated first set leads to the second leadframe, thereby creating a 3-dimensional conductively linked network of components and leads.
2 more elements
Dependencies are inferred from the claim text.