Semiconductor device for upper and lower arm circuits
AssigneeDenso Corporation
InventorsTakahiro Hirano, Masayoshi Nishihata, Chihiro Kato
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AssigneeDenso Corporation
InventorsTakahiro Hirano, Masayoshi Nishihata, Chihiro Kato
Estimating the term…
A semiconductor device includes: a first element for one of upper and lower arm circuits; a second element for the other of the upper and lower arm circuits; a first wiring having a first mounting portion on which the first element is disposed and a first power supply terminal portion connected with the first mounting portion; a second wiring having a second mounting portion on which the second element is disposed and an output terminal portion connected with the second mounting portion; a clip configured to electrically connect a main electrode of the first element and the second mounting portion; and a third wiring having a connection portion to which a main electrode of the second element is connected and a second power supply terminal portion connected with the connection portion. The third wiring is extended parallel to the first wiring and the clip.
A semiconductor device for upper and lower arm circuits of at least one phase, comprising:
Dependencies are inferred from the claim text.