H10W 72/637
Multiple strap connectors having different shapes
Official title: {Multiple strap connectors having different shapes}
H10W72/637 (Multiple strap connectors having different shapes) appears on 45 US grants and 65 published applications in this corpus.
Search patents in H10W- Granted patents
- 45
- Published applications
- 65
- Assignees
- 24
- Inventors
- 122
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 2 |
| 2013 | 2 | 3 |
| 2014 | 0 | 1 |
| 2015 | 4 | 5 |
| 2016 | 3 | 7 |
| 2017 | 7 | 4 |
| 2018 | 2 | 0 |
| 2019 | 1 | 5 |
| 2020 | 6 | 8 |
| 2021 | 5 | 7 |
| 2022 | 4 | 3 |
| 2023 | 5 | 0 |
| 2024 | 1 | 6 |
| 2025 | 4 | 5 |
| 2026 | 1 | 9 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Stacked clip design for GaN half bridge IPM28 Oct 2025US 12,456,707 B2Texas Instruments Incorporated
- Connecting strip for discrete and power electronic devices29 Jul 2025US 12,374,648 B2STMicroelectronics S,r.l.
- Semiconductor device and a method of manufacture1 Jul 2025US 12,347,751 B2Nexperia B. V.
- Fingerprint sensor package and smart card having the same6 May 2025US 12,294,000 B2Samsung Electronics Co., Ltd.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Package method for paralleling power semiconductor devices11 Jun 2026US 2026/0165180 A1Semiconductor Components Industries, LLC
- Semiconductor device and package with kelvin source connection28 May 2026US 2026/0150761 A1Nexperia B. V.
- Semiconductor device7 May 2026US 2026/0130261 A1Denso Corporation
- Semiconductor device9 Apr 2026US 2026/0101772 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Method for fabricating stack die package23US 9,589,929 B2Vishay-Siliconix · 2017
- Packaging solutions for devices and systems comprising lateral GaN power transistors20US 9,589,868 B2GaN Systems Inc. · 2017
- Packaging solutions for devices and systems comprising lateral GaN power transistors11US 9,589,869 B2GaN Systems Inc. · 2017
- Semiconductor package7US 9,601,453 B2MagnaChip Semiconductor, Ltd. · 2017
- Packaging solutions for devices and systems comprising lateral GaN power transistors7US 9,824,949 B2GaN Systems Inc. · 2017