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US 9,601,453 B2Granted
Semiconductor package
AssigneeMagnaChip Semiconductor, Ltd.
InventorFrancois Hebert
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor package. The semiconductor package includes: a first die that is a monolithic type die, a driver circuit and a low-side output power device formed in the first die; a second die disposed above the first die, the second die comprising a high-side output power device; and a first connection unit disposed between the first die and the second die.
Claims21
A semiconductor package comprising:
- a monolithic type first die comprising a driver circuit and a low-side output power device connected to the driver circuit;
- a second die disposed above the first die, the second die comprising a high-side output power device;
- a first connection unit connecting a top of the first die and a bottom of the second die;
- and
- a second connection unit disposed on the second die.
2 more elements
A semiconductor package comprising:
- a monolithic type first die comprising a driver circuit and a low-side output power device connected to the driver circuit;
- a second die disposed above the first die, the second die comprising a high-side output power device;
- and
- a connection unit connecting an electrode on a top surface of the second die to an input voltage.
1 more element
Dependencies are inferred from the claim text.