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US 9,589,929 B2Granted
Method for fabricating stack die package
AssigneeVishay-Siliconix
InventorsKyle Terrill, Frank Kuo, Sen Mao
Life of this patent
Estimating the term…
Abstract
In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and a drain that are located on a first surface of the second die and the source that is located on a second surface of the second die that is opposite the first surface.
Claims20
A method comprising:
- attaching a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface;
- coupling a source of a second die to said drain of said first die, said second die comprising a gate and a drain that are located on a first surface of said second die and said source that is located on a second surface of said second die that is opposite said first surface;
- attaching a clip to said lead frame and said drain of said second die, said clip comprising a first platform, a second platform, and a sloped portion located between said first platform and said second platform, said first platform is located above said second platform;
- performing a molding process comprising covering said first die, second die, and clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said clip;
- and
- preventing said portion of said upper surface of said clip from being plated during a plating process, said portion of said upper surface of said clip is exposed in final package.
3 more elements
A method comprising:
- attaching a gate and a source of a first die to a lead frame with solder paste, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising split gate technology;
- coupling a source of a second die to said drain of said first die, said second die comprising a gate and a drain that are located on a first surface of said second die and said source that is located on a second surface of said second die that is opposite said first surface;
- attaching a clip to said lead frame and said drain of said second die with solder paste, said clip comprising a first platform, a second platform, and a sloped portion located between said first platform and said second platform said first platform is located above said second platform;
- performing a molding process comprising covering said first die, second die, and clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said clip;
- and
- preventing said portion of said upper surface of said clip from being plated during a plating process, said portion of said upper surface of said clip is exposed in final package.
3 more elements
A method comprising:
- attaching a gate and a source of a first die to a lead frame with conductive adhesive, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising split gate technology;
- coupling a source of a second die to said drain of said first die, said second die comprising a gate and a drain that are located on a first surface of said second die and said source that is located on a second surface of said second die that is opposite said first surface;
- attaching a clip to said lead frame and said drain of said second die with conductive adhesive, said clip comprising a first platform, a second platform, and a sloped portion located between said first platform and said second platform, said first platform is located above said second platform;
- performing a molding process comprising covering said first die, second die, and clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said clip;
- and
- preventing said portion of said upper surface of said clip from being plated during a plating process, said portion of said upper surface of said clip is exposed in final package.
3 more elements
Dependencies are inferred from the claim text.