Semiconductor device
AssigneeDenso Corporation
InventorsTakahiro HIRANO, Masayuki KAMIYA
Life of this patent
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Abstract
A semiconductor device includes at least one semiconductor element, a metal plate and a solder. The semiconductor element includes a semiconductor substrate having an element region, a main electrode disposed at a position overlapping with the element region on one surface of the semiconductor substrate, a signal line disposed at a position overlapping with the element region on the one surface and different from the position of the main electrode, and an insulating film covering the signal line. The metal plate has a joint portion to the main electrode. The solder is interposed between the main electrode and the joint portion and joins the main electrode and the metal plate. The joint portion is disposed to avoid the signal line.
Claims12
A semiconductor device comprising:
- at least one semiconductor element that includes
- a semiconductor substrate having an element region,
- a main electrode disposed at a position overlapping with the element region on one surface of the semiconductor substrate,
- a signal line disposed at a position overlapping with the element region on the one surface and being different from the position of the main electrode, and
- an insulating film covering the signal line and interposed by the main electrode in a plan view in a thickness direction of the semiconductor substrate;
- a metal plate having a joint portion to the main electrode;
- and
- a solder interposed between the main electrode and the joint portion of the metal plate and joining the main electrode and the metal plate, wherein
- the joint portion is disposed to avoid the signal line.
Dependencies are inferred from the claim text.