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US 12,347,751 B2Granted
Semiconductor device and a method of manufacture
AssigneeNexperia B.V.
InventorsRicardo Yandoc, Florante Fenol, Marlon Fadullo, Ramil Atienza
Life of this patent
Estimating the term…
Abstract
A semiconductor device including a lead frame, a die attached to the lead frame using a first solder, and a clip attached to the die using a second solder is provided. The clip includes a notch arranged for a check of the excess of the second solder.
Claims19
A semiconductor device comprising:
- transistor comprising a source, a gate, and a drain;
- a lead frame;
- a die of the transistor connected to the lead frame using a first solder;
- a clip connected to the die using a second solder, the clip comprising a plurality of notches arranged for a check of an excess of the second solder,
- wherein the clip comprises:
- a source clip for the source of the transistor comprising a source terminal and at least one of the plurality of notches provided on the source clip over an edge of the die;
- and a gate clip for the gate of the transistor comprising a gate terminal and another of the plurality of notches provided on the gate clip over the edge of the die.
4 more elements
A method of producing a semiconductor device, the method comprising the steps of:
- forming a lead frame;
- attaching a die for a semiconductor transistor comprising a source, a gate, and a drain to the lead frame using a first solder;
- and
- attaching a clip to the die using a second solder, the clip comprising a plurality of notches arranged for a check of an excess of the second solder, wherein the clip comprises:
- a source clip for the source of the transistor comprising a source terminal and at least one of the plurality of notches provided over the edge of the die on the source clip;
- and
- a gate clip for the gate of the transistor comprising a gate terminal and another of the plurality of notches provided over the edge of the die on the gate clip.
4 more elements
Dependencies are inferred from the claim text.