H10W 72/691
Bond pads specially adapted therefor
Official title: {Bond pads specially adapted therefor}
H10W72/691 (Bond pads specially adapted therefor) appears on 252 US grants and 313 published applications in this corpus.
Search patents in H10W- Granted patents
- 252
- Published applications
- 313
- Assignees
- 60
- Inventors
- 533
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 1 | 1 |
| 2010 | 2 | 2 |
| 2011 | 1 | 2 |
| 2012 | 2 | 8 |
| 2013 | 9 | 11 |
| 2014 | 9 | 20 |
| 2015 | 21 | 17 |
| 2016 | 16 | 15 |
| 2017 | 13 | 18 |
| 2018 | 15 | 24 |
| 2019 | 12 | 25 |
| 2020 | 16 | 40 |
| 2021 | 36 | 30 |
| 2022 | 25 | 30 |
| 2023 | 20 | 31 |
| 2024 | 28 | 18 |
| 2025 | 19 | 14 |
| 2026 | 5 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and semiconductor module26 May 2026US 12,642,121 B2Fuji Electric Co., Ltd.
- Semiconductor module5 May 2026US 12,622,334 B2Rohm Co., Ltd.
- Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package10 Mar 2026US 12,575,468 B2STMicroelectronics S,r.l.
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Module with gas flow-inhibiting sealing at module interface to mounting base6 Jan 2026US 12,519,023 B2Infineon Technologies AG
- Semiconductor package and a bond clip for use in the semiconductor package4 Jun 2026US 2026/0157243 A1Nexperia B. V.
- Semiconductor module2 Apr 2026US 2026/0096499 A1Rohm Co., Ltd.
- Semiconductor device12 Feb 2026US 2026/0047511 A1Rohm Co., Ltd.
- Semiconductor module18 Dec 2025US 2025/0385165 A1Rohm Co., Ltd.
- Liquid metal interconnects for power semiconductor modules11 Dec 2025US 2025/0379167 A1The Board of Trustees of The University of Alabama
Most cited
By later US patents
- Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures81US 6,232,152 B1Tessera, Inc. · 2001
- Solderable contact regions22US 8,975,175 B1SunPower Corporation · 2015
- Semiconductor device and method of manufacturing a semiconductor device16US 10,134,687 B1Amkor Technology, Inc. · 2018
- Semiconductor device and method for fabricating the same13US 9,318,471 B2Panasonic Intellectual Property Management Co., Ltd. · 2016
- Power MOSFET having selectively silvered pads for clip and bond wire attach12US 8,586,480 B1IXYS Corporation · 2013