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US 12,519,023 B2Granted
Module with gas flow-inhibiting sealing at module interface to mounting base
AssigneeInfineon Technologies AG
InventorsJohannes Uhlig, Sven Hagebusch, Marco Ludwig, Ulrich Nolten
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Abstract
A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.
Claims21
An electronic device, comprising:
- a mounting base;
- and
- a module mounted on the mounting base,
- wherein the module comprises:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is mounted on the mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein the gas flow-inhibiting sealing is made of a compressible material and/or an elastic material.
6 more elements
A method of manufacturing a module, the method comprising:
- at least partially enclosing an electronic component in an enclosure which defines a module interface at which the module is configured to be mounted on a mounting base;
- and
- providing a gas flow-inhibiting sealing at the module interface for inhibiting gas from propagating from an exterior of the module towards the electronic component when the module is mounted at the mounting base,
- wherein the gas flow-inhibiting sealing is made of a compressible material and/or an elastic material.
1 more element
An electronic device, comprising:
- a mounting base;
- and
- a module mounted on the mounting base,
- wherein the module comprises:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is mounted on the mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component, wherein the gas flow-inhibiting sealing is a gas flow-tight sealing.
5 more elements
An electronic device, comprising:
- a mounting base;
- and
- a module mounted on the mounting base,
- wherein the module comprises:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is mounted on the mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein:
- the gas flow-inhibiting sealing comprises a gas-diffusion inhibiting material, and/or
- the gas flow-inhibiting sealing comprises sacrificial particles configured to consume corrosive gas and the electronic component has at least one pad made of a corrodible material being corrodible by the corrosive gas.
8 more elements
An electronic device, comprising:
- a mounting base;
- and
- a module mounted on the mounting base,
- wherein the module comprises:
- an electronic component;
- electrically conductive needles electrically coupling the electronic component with the mounting base;
- an enclosure at least partially enclosing the electronic component and the electrically conductive needles, the enclosure defining a module interface at which the module is mounted on the mounting base;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein the gas flow-inhibiting sealing is made of a compressible material and/or an elastic material.
7 more elements
An electronic device, comprising:
- a printed circuit board;
- and
- a module mounted on the printed circuit board,
- wherein the module comprises:
- an electronic component;
- an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is mounted on the printed circuit board;
- and
- a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component,
- wherein the gas flow-inhibiting sealing is made of a compressible material and/or an elastic material.
6 more elements
Dependencies are inferred from the claim text.