Semiconductor module

A semiconductor module provided with a half-bridge circuit, the semiconductor module comprising:

• a supporting substrate including a first insulating layer, a first metal layer and a second metal layer;
• a first conductive portion and a second conductive portion both bonded to the supporting substrate and made of a metal plate member;
• a first semiconductor element and a second semiconductor element constituting an upper arm circuit and a lower arm circuit, respectively, in the half-bridge circuit and both having a switching function;
• a first wiring substrate disposed on the first conductive portion and electrically connected to the first semiconductor element, and a second wiring substrate disposed on the second conductive portion and electrically connected to the second semiconductor element;
• a first input terminal disposed on one side of a first direction perpendicular to a thickness direction relative to the first semiconductor element and the first conductive portion;
• a second input terminal and a third input terminal both disposed on the one side of the first direction relative to the first semiconductor element and the first conductive portion, the second input terminal and the third input terminal being opposite from each other with the first input terminal sandwiched therebetween in a second direction perpendicular to the thickness direction and the first direction;
• at least one output terminal disposed on another side of the first direction relative to the second semiconductor element (10B) and the second conductive portion;
• a conducting member constituting a part of a first main circuit current path through which a first main circuit current flows between the first input terminal and the output terminal, while also constituting a part of a second main circuit current path through which a second main circuit current flows between the output terminal and the second and the third input terminals;
• and
• a sealing resin having a resin obverse surface and a resin reverse surface facing opposite from the resin obverse surface, the sealing resin covering a part of the supporting substrate, the first conductive portion, the second conductive portion, the first semiconductor element, the second semiconductor element, a part of the first input terminal, a part of the second input terminal, a part of the third input terminal, a part of the output terminal, the first wiring substrate, the second wiring substrate and the conducting member,
• wherein each of the first main circuit current path and the second main circuit current path is symmetrical, as viewed in the thickness direction, with respect to a center line passing through a center of the first input terminal and extending in the first direction.