H10W 72/20
Bump connectors
Official title: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
H10W72/20 (Bump connectors) appears on 39,198 US grants and 44,867 published applications in this corpus.
Search patents in H10W- Granted patents
- 39,198
- Published applications
- 44,867
- Assignees
- 3,412
- Inventors
- 38,021
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 19 | 0 |
| 1978 | 12 | 0 |
| 1979 | 11 | 0 |
| 1980 | 20 | 0 |
| 1981 | 16 | 0 |
| 1982 | 13 | 0 |
| 1983 | 9 | 0 |
| 1984 | 17 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 27 | 0 |
| 1988 | 27 | 0 |
| 1989 | 49 | 0 |
| 1990 | 70 | 0 |
| 1991 | 74 | 0 |
| 1992 | 83 | 0 |
| 1993 | 104 | 0 |
| 1994 | 154 | 0 |
| 1995 | 155 | 0 |
| 1996 | 169 | 0 |
| 1997 | 192 | 0 |
| 1998 | 332 | 0 |
| 1999 | 419 | 0 |
| 2000 | 523 | 0 |
| 2001 | 682 | 381 |
| 2002 | 816 | 1025 |
| 2003 | 896 | 1030 |
| 2004 | 869 | 1256 |
| 2005 | 862 | 1465 |
| 2006 | 966 | 1438 |
| 2007 | 920 | 1569 |
| 2008 | 905 | 1640 |
| 2009 | 921 | 1642 |
| 2010 | 1259 | 1526 |
| 2011 | 1393 | 1657 |
| 2012 | 1385 | 1692 |
| 2013 | 1599 | 1826 |
| 2014 | 1747 | 2036 |
| 2015 | 1800 | 2109 |
| 2016 | 1974 | 1872 |
| 2017 | 2006 | 1983 |
| 2018 | 1815 | 1881 |
| 2019 | 1889 | 2242 |
| 2020 | 2049 | 2599 |
| 2021 | 1873 | 2429 |
| 2022 | 1903 | 2232 |
| 2023 | 1927 | 2095 |
| 2024 | 1740 | 2458 |
| 2025 | 1506 | 1827 |
| 2026 | 957 | 957 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Single backside power plane for improved power delivery6 Oct 2026US 12,757,716 B2International Business Machines Corporation
- Semiconductor device and semiconductor device fabrication method6 Oct 2026US 12,757,726 B2Lapis Semiconductor Co., Ltd.
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor devices with photonic interconnect platforms and crossbar switches8 Oct 2026US 2026/0309948 A1
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic circuit layers for photonic interconnect platforms8 Oct 2026US 2026/0314026 A1
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015