H10W 72/281
Auxiliary members
Official title: {Auxiliary members}
H10W72/281 (Auxiliary members) appears on 1,238 US grants and 1,372 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,238
- Published applications
- 1,372
- Assignees
- 346
- Inventors
- 2,330
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 10 | 0 |
| 2000 | 17 | 0 |
| 2001 | 13 | 6 |
| 2002 | 9 | 32 |
| 2003 | 31 | 41 |
| 2004 | 24 | 29 |
| 2005 | 26 | 36 |
| 2006 | 29 | 41 |
| 2007 | 33 | 56 |
| 2008 | 29 | 38 |
| 2009 | 29 | 51 |
| 2010 | 30 | 27 |
| 2011 | 36 | 51 |
| 2012 | 31 | 62 |
| 2013 | 45 | 59 |
| 2014 | 64 | 92 |
| 2015 | 84 | 123 |
| 2016 | 100 | 65 |
| 2017 | 87 | 80 |
| 2018 | 80 | 63 |
| 2019 | 78 | 74 |
| 2020 | 59 | 66 |
| 2021 | 54 | 70 |
| 2022 | 45 | 51 |
| 2023 | 55 | 46 |
| 2024 | 39 | 47 |
| 2025 | 36 | 40 |
| 2026 | 17 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Die package with sealed die enclosures15 Sep 2026US 12,738,918 B2QUALCOMM Incorporated
- Electronic device8 Sep 2026US 12,733,524 B2Advanced Semiconductor Engineering, Inc.
- Bump structure and method of making the same8 Sep 2026US 12,733,529 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Semiconductor package and method for manufacturing the same18 Aug 2026US 12,713,895 B2Samsung Electronics Co., Ltd.
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package1 Oct 2026US 2026/0305413 A1LG Innotek Co., Ltd.
- Semiconductor devices with a solder bridge resistant substrate13 Aug 2026US 2026/0239997 A1Texas Instruments Incorporated
- Redistribution layers and methods of fabricating the same in semiconductor devices23 Jul 2026US 2026/0215320 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including an integrated circuit die and an inductor or a transformer9 Jul 2026US 2026/0198021 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities352US 7,049,170 B2Tru-Si Technologies, Inc. · 2006
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit303US 7,068,072 B2Xilinx, Inc. · 2006
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989