H10W 72/283
Reinforcing structures
Official title: {Reinforcing structures, e.g. bump collars}
H10W72/283 (Reinforcing structures) appears on 610 US grants and 677 published applications in this corpus.
Search patents in H10W- Granted patents
- 610
- Published applications
- 677
- Assignees
- 167
- Inventors
- 1,098
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 3 |
| 2002 | 4 | 13 |
| 2003 | 11 | 18 |
| 2004 | 12 | 19 |
| 2005 | 14 | 18 |
| 2006 | 15 | 22 |
| 2007 | 22 | 25 |
| 2008 | 12 | 20 |
| 2009 | 14 | 22 |
| 2010 | 12 | 14 |
| 2011 | 17 | 28 |
| 2012 | 22 | 39 |
| 2013 | 24 | 28 |
| 2014 | 29 | 49 |
| 2015 | 38 | 57 |
| 2016 | 51 | 32 |
| 2017 | 52 | 51 |
| 2018 | 46 | 38 |
| 2019 | 51 | 38 |
| 2020 | 32 | 27 |
| 2021 | 27 | 29 |
| 2022 | 14 | 17 |
| 2023 | 22 | 19 |
| 2024 | 16 | 19 |
| 2025 | 16 | 23 |
| 2026 | 6 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method for manufacturing the same18 Aug 2026US 12,713,895 B2Samsung Electronics Co., Ltd.
- Semiconductor device and manufacturing method thereof7 Jul 2026US 12,677,698 B2Kioxia Corporation
- Half-buried electrical connection insert rod device28 Apr 2026US 12,616,054 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Package structures with collapse control features14 Apr 2026US 12,604,733 B2Intel Corporation
- Package structures with patterned die backside layer7 Apr 2026US 12,598,989 B2Intel Corporation
- Redistribution layers and methods of fabricating the same in semiconductor devices23 Jul 2026US 2026/0215320 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Under-bump metallization structure and methods of forming the same18 Jun 2026US 2026/0173940 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ring structure for interconnect structures and methods of forming the same11 Jun 2026US 2026/0165134 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Structure and formation method of package with heat-spreading lid21 May 2026US 2026/0144057 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package for stress isolation14 May 2026US 2026/0136979 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities352US 7,049,170 B2Tru-Si Technologies, Inc. · 2006
- Chip scale packages and methods for manufacturing the chip scale packages at wafer level220US 6,187,615 B1Samsung Electronics Co., Ltd. · 2001
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Method for manufacturing raised electrical contact pattern of controlled geometry196US 6,215,670 B1FormFactor, Inc. · 2001