Half-buried electrical connection insert rod device
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsNatacha Raphoz, Stéphane Caplet, Patrick Peray
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Abstract
A system provided with a microelectronic device includes a substrate exposed on a face of the device, the substrate having at least one electrically conductive element, and an electrical connection member in electrical continuity with the element and including at least one rod projecting over the face of the device, wherein the connection member includes an inorganic anchoring portion covering the element and in that the rod comprises a portion buried in the anchoring portion followed by a portion projecting over the face of the device.
Claims20
A system comprising:
- a microelectronic device comprising a substrate exposed on a face of the device, the substrate comprising at least one electrically conductive element, and an electrical connection member in electrical continuity with the element and comprising at least one rod projecting over the face of the device,
- and a complementary microelectronic device comprising at least one complementary electrically conductive element and a terminal which is electrically connected to the complementary element and which is exposed on a face of the complementary device,
- wherein the electrical connection member comprises an inorganic anchoring portion covering the at least one electrically conductive element and in that the at least one rod comprises a buried portion buried in the inorganic anchoring portion followed by a projecting portion projecting over the face of the device, the projecting portion of the at least one rod being inserted in the terminal, and
- wherein the projecting portion of the at least one rod has a greater length than a length of the buried portion.
A method for manufacturing a system comprising a microelectronic device comprising a substrate exposed on a face of the microelectronic device, the substrate comprising at least one electrically conductive element, and an electrical connection member in electrical continuity with the at least one electrically conductive element and comprising at least one rod projecting over the face of the microelectronic device, the method comprising:
- covering the at least one electrically conductive element by an inorganic anchoring portion and forming a via with a first end and a second end opposite the first end, the via passing through the inorganic anchoring portion, such that the second end is flush with the surface of the inorganic anchoring portion;
- partially removing the inorganic anchoring portion to remove some of the thickness of the inorganic anchoring portion by leaving a residual part of the inorganic anchoring portion, the via thus forming the at least one rod with a part of the via removed relative to the residual inorganic anchoring portion to form a projecting portion and a part of the via preserved in the residual inorganic anchoring portion to form a buried portion;
- and
- electrically connecting the microelectronic device with a complementary microelectronic device comprising at least one complementary electrically conductive element and a terminal which is electrically connected to the complementary element and which is exposed on a face of the complementary device, the projecting portion of the at least one rod being inserted in the terminal.
A method for manufacturing a system comprising a microelectronic device comprising a substrate exposed on a face of the microelectronic device, the substrate comprising at least one electrically conductive element, and an electrical connection member in electrical continuity with the at least one electrically conductive element and comprising at least one rod projecting over the face of the microelectronic device, the method comprising:
- covering the at least one electrically conductive element by an inorganic anchoring portion and forming a via with a first end and a second end opposite the first end, the via passing through the inorganic anchoring portion, such that the second end is flush with the surface of the inorganic anchoring portion;
- partially removing the inorganic anchoring portion to remove some of the thickness of the inorganic anchoring portion by leaving a residual part of the inorganic anchoring portion, the via thus forming the at least one rod with a part of the via removed relative to the residual inorganic anchoring portion to form a projecting portion and a part of the via preserved in the residual inorganic anchoring portion to form a buried portion;
- and
- electrically connecting the microelectronic device with a complementary microelectronic device comprising at least one complementary electrically conductive element and a terminal which is electrically connected to the complementary element and which is exposed on a face of the complementary device, the projecting portion of the at least one rod being inserted in the terminal,
- wherein the projecting portion of the at least one rod has a greater length than a length of the buried portion.
Dependencies are inferred from the claim text.