Package structures with patterned die backside layer
AssigneeIntel Corporation
InventorsPilin Liu, Feras Eid, Michael Baker, Wenhao Li, Zhaozhi Li
Life of this patent
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Abstract
Microelectronic die package structures formed according to some embodiments may include a substrate and a die having a first side and a second side. The first side of the die is coupled to the substrate, and a die backside layer is on the second side of the die. The die backside layer includes a plurality of unfilled grooves in the die backside layer. Each of the unfilled grooves has an opening at a surface of the die backside layer, opposite the second side of the die, and extends at least partially through the die backside layer.
Claims13
A microelectronic die package structure comprising:
- a substrate;
- a die comprising a first side and a second side, wherein the first side of the die is coupled to the substrate;
- and
- a die backside layer on the second side of the die, wherein the die backside layer comprises a plurality of unfilled grooves in the die backside layer, each of the unfilled grooves comprising an opening at a surface of the die backside layer opposite the second side of the die and extending at least partially through the die backside layer, wherein at least one of the unfilled grooves extends completely through the die backside layer.
A computer system comprising;
- a power supply;
- one or more integrated circuit packages coupled to the power supply, wherein at least one of the integrated circuit packages comprises:
- a substrate comprising a surface;
- one or more conductive interconnect structures on the surface of the substrate;
- a die comprising a first side and a second side, wherein the first side of the die is coupled to the one or more conductive interconnect structures;
- and
- a die backside layer on the second side of the die, wherein the die backside layer comprises one or more unfilled grooves comprising an opening at a surface of the die backside layer opposite the second side of the die and extending at least partially through the die backside layer, wherein a length of the opening is the same as at least one of a length of the die or a width of the die.
Dependencies are inferred from the claim text.