US 5,334,804 A · Wire interconnect structures for connecting an integrated circuit to a substrate

Abstract

An interconnect structure for connecting an integrated circuit (IC) chip to a supporting substrate is described. The supporting substrate serves to communicate signals between the IC chip and the "outside world," such as other IC chips. In one embodiment, the interconnect structure comprises an interconnect substrate having a first post disposed on one of its surfaces and a second post disposed on another of its surfaces. One post is for contacting the IC chip and the other is for contacting the major substrate. Each post comprises an elongated body having top and bottom ends, with the bottom end being mounted to one of the substrate surfaces and the top end having a substantially flat surface which is substantially co-planer with the substrate surface. The interconnect substrate further comprises a device for de-concentrating the mechanical stain present at one or both of the top and bottom ends of each post. The first and second posts are electrically coupled to one anther so that an electrical signal may pass from IC chip to the supporting substrate, and vice-versa.

Claims25

Dependent claims

A wire interconnect structure for electrically coupling a substrate to an integrated circuit chip, comprising:

an electrically conductive post disposed on a surface of said substrate for making contact to the integrated circuit, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on the surface of the substrate and the top end for connecting to the integrated circuit chip by an electrical-conductive, reflowable material, said post comprising a material having a higher melting point than the reflowable material such that when the post is connected to the integrated circuit the shape of said post does not substantially change;
a peripheral edge formed around said bottom end next to said surface;
and
a solder fillet disposed along said peripheral edge.

1 more element

A wire interconnect structure for electrically coupling a major substrate to an integrated circuit chip, comprising:

an interconnect substrate having a first surface and a second surface;
a first electrically conductive post disposed on the first surface of said interconnect substrate for making contact to one of the integrated circuit and the major substrate, said first post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the first surface of said interconnect substrate, the top end for connecting to one of the chip and major substrate by an electrically-conductive, reflowable material, said time post comprising a material having a higher melting point than the reflowable material such that the shape of said first post does not substantially change when the first post is connected;
a second electrically conductive post disposed on the second surface of said interconnect substrate for making contact to the other of the integrated circuit and the major substrate, said second post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the second surface of said interconnect substrate, the top end for coupling to the other of the chip and major substrate by an electrically conductive, reflowable material said second post comprising a material having a higher melting point than the reflowable material such that the shape of said second post does not substantially change when the second post is connected;
and
coupling means on said interconnect substrate for electrically coupling said first post to said second post.

2 more elements

Dependencies are inferred from the claim text.

Wire interconnect structures for connecting an integrated circuit to a substrate

Life of this patent

Wire interconnect structures for connecting an integrated circuit to a substrate

Life of this patent

Abstract

Claims25