Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit
AssigneeXilinx, Inc.
InventorsBernard J. New, Robert O. Conn, Steven P. Young, Edel M. Young
Life of this patent
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AssigneeXilinx, Inc.
InventorsBernard J. New, Robert O. Conn, Steven P. Young, Edel M. Young
Estimating the term…
A general purpose interface tile of a first integrated circuit includes a plurality of micropads. A second integrated circuit may be stacked on the first integrated circuit such that signals from the second integrated circuit are communicated through the micropads and the interface tile to other circuitry on the first integrated circuit. Similarly, signals from the first integrated circuit are communicated through the interface tile and the micropads to the second integrated circuit. In the event that the first integrated circuit is a programmable logic device having a programmable interconnect structure, the interface tile is part of and hooks into the programmable interconnect structure and provides a general purpose mechanism for coupling signals from the second integrated circuit to the programmable interconnect structure and/or for coupling signals from the programmable interconnect structure to the second integrated circuit.
An integrated circuit die comprising an array of tiles, the tiles arranged in rows and columns, wherein one of the tiles is a routing tile having four edges, the routing tile having other tiles adjacent each of its four edges, the routing tile comprising:
A method, comprising:
An integrated circuit die comprising
An integrated circuit structure, comprising:
Dependencies are inferred from the claim text.