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US 12,738,918 B2Granted
Die package with sealed die enclosures
AssigneeQUALCOMM Incorporated
InventorBart Kassteen
Life of this patent
Estimating the term…
Abstract
Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate.
Claims40
An apparatus comprising:
- a die;
- a perimeter metallization disposed on a perimeter of the die;
- a package substrate;
- and
- a seal coupled to the perimeter metallization and the package substrate, wherein the seal is configured to seal the die to the package substrate;
- wherein the perimeter metallization continuously extends along the perimeter of the die.
3 more elements
A method for fabricating an apparatus, the method comprising:
- forming a die;
- forming a perimeter metallization on a perimeter of the die;
- forming a package substrate;
- and
- coupling a seal to the perimeter metallization and the package substrate, wherein the seal is configured to seal the die to the package substrate;
- wherein the perimeter metallization continuously extends along the perimeter of the die.
3 more elements
Dependencies are inferred from the claim text.