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US 2026/0239997 A1Published application
Semiconductor devices with a solder bridge resistant substrate
AssigneeTexas Instruments Incorporated
InventorsGUANGXU LI, JAIMAL WILLIAMSON, RAJEN MANICON MURUGAN, SYLVESTER ANKAMAH-KUSI, JEFFREY SOLAS
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Abstract
A semiconductor device with a solder bridge resistant substrate. For example, a semiconductor package can include a substrate that can include a dielectric material and substrate pads. A cavity in the dielectric material can separate the substrate pads. A die is coupled to the substrate using a solder. The solder fills a portion of the cavity.
Claims20
A semiconductor package comprising:
- a substrate comprising a dielectric material and substrate pads, wherein a cavity in the dielectric material separates the substrate pads;
- and
- a die being coupled to the substrate using a solder, wherein the solder fills a portion of the cavity.
A semiconductor package comprising:
- a substrate comprising a dielectric material, substrate pads and a solder resist on a surface of the substrate between neighboring substrate pads of the substrate pads, wherein a cavity in the dielectric material separates the substrate pads;
- and
- a die being coupled to the substrate using a solder, wherein the solder fills a portion of the cavity.
A method of fabricating a semiconductor package, comprising:
- forming a cavity in a dielectric material of a substrate between substrate pads of the substrate;
- positioning a die with respect to the substrate so that solder on the die is coaxial with respect to the substrate pads;
- reflowing the solder to cause the solder to partially fill the cavity;
- and
- encapsulating the die and the substrate with a molding material to form the semiconductor package.
2 more elements
Dependencies are inferred from the claim text.