H10W 72/241
Dispositions
Official title: {Dispositions, e.g. layouts}
H10W72/241 (Dispositions) appears on 18,673 US grants and 22,048 published applications in this corpus.
Search patents in H10W- Granted patents
- 18,673
- Published applications
- 22,048
- Assignees
- 1,724
- Inventors
- 18,077
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 10 | 0 |
| 1991 | 8 | 0 |
| 1992 | 17 | 0 |
| 1993 | 16 | 0 |
| 1994 | 28 | 0 |
| 1995 | 19 | 0 |
| 1996 | 24 | 0 |
| 1997 | 37 | 0 |
| 1998 | 45 | 0 |
| 1999 | 81 | 0 |
| 2000 | 82 | 0 |
| 2001 | 145 | 88 |
| 2002 | 156 | 211 |
| 2003 | 205 | 243 |
| 2004 | 206 | 298 |
| 2005 | 207 | 387 |
| 2006 | 223 | 382 |
| 2007 | 234 | 458 |
| 2008 | 243 | 578 |
| 2009 | 308 | 625 |
| 2010 | 455 | 694 |
| 2011 | 574 | 795 |
| 2012 | 636 | 945 |
| 2013 | 812 | 1068 |
| 2014 | 953 | 1177 |
| 2015 | 1049 | 1368 |
| 2016 | 1240 | 1221 |
| 2017 | 1341 | 1333 |
| 2018 | 1199 | 1230 |
| 2019 | 1234 | 1411 |
| 2020 | 1315 | 1647 |
| 2021 | 1154 | 1464 |
| 2022 | 1180 | 1306 |
| 2023 | 1157 | 916 |
| 2024 | 979 | 923 |
| 2025 | 758 | 811 |
| 2026 | 325 | 469 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Single backside power plane for improved power delivery6 Oct 2026US 12,757,716 B2International Business Machines Corporation
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process6 Oct 2026US 12,757,761 B2Intel Corporation
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Semiconductor devices with photonic interconnect platforms and crossbar switches8 Oct 2026US 2026/0309948 A1
- Electronic circuit layers for photonic interconnect platforms8 Oct 2026US 2026/0314026 A1
- Layer-by-layer formation of through-substrate via8 Oct 2026US 2026/0314369 A1Taiwan Semiconductor Manufacturing Company.Ltd
- High-density interconnect region with mixed bump widths8 Oct 2026US 2026/0314440 A1Intel Corporation
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015