H10W 72/247
Dispositions of multiple bumps
Official title: {Dispositions of multiple bumps}
H10W72/247 (Dispositions of multiple bumps) appears on 5,052 US grants and 6,215 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,052
- Published applications
- 6,215
- Assignees
- 738
- Inventors
- 7,112
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 20 | 15 |
| 2002 | 11 | 28 |
| 2003 | 31 | 32 |
| 2004 | 26 | 41 |
| 2005 | 30 | 53 |
| 2006 | 30 | 43 |
| 2007 | 22 | 72 |
| 2008 | 40 | 104 |
| 2009 | 44 | 72 |
| 2010 | 67 | 100 |
| 2011 | 88 | 179 |
| 2012 | 116 | 228 |
| 2013 | 202 | 320 |
| 2014 | 269 | 354 |
| 2015 | 316 | 414 |
| 2016 | 401 | 378 |
| 2017 | 382 | 375 |
| 2018 | 324 | 320 |
| 2019 | 330 | 422 |
| 2020 | 374 | 504 |
| 2021 | 330 | 506 |
| 2022 | 408 | 416 |
| 2023 | 402 | 346 |
| 2024 | 321 | 341 |
| 2025 | 278 | 303 |
| 2026 | 139 | 249 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Electronic circuit layers for photonic interconnect platforms8 Oct 2026US 2026/0314026 A1
- High-density interconnect region with mixed bump widths8 Oct 2026US 2026/0314440 A1Intel Corporation
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015