H10W 72/244
Relative to underlying supporting features
Official title: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
H10W72/244 (Relative to underlying supporting features) appears on 5,215 US grants and 6,119 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,215
- Published applications
- 6,119
- Assignees
- 725
- Inventors
- 6,978
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 12 | 0 |
| 1999 | 19 | 0 |
| 2000 | 15 | 0 |
| 2001 | 28 | 22 |
| 2002 | 38 | 53 |
| 2003 | 50 | 61 |
| 2004 | 58 | 75 |
| 2005 | 52 | 131 |
| 2006 | 68 | 115 |
| 2007 | 60 | 151 |
| 2008 | 61 | 177 |
| 2009 | 101 | 198 |
| 2010 | 164 | 268 |
| 2011 | 185 | 260 |
| 2012 | 213 | 301 |
| 2013 | 299 | 315 |
| 2014 | 294 | 354 |
| 2015 | 318 | 357 |
| 2016 | 375 | 382 |
| 2017 | 404 | 417 |
| 2018 | 360 | 335 |
| 2019 | 326 | 373 |
| 2020 | 329 | 376 |
| 2021 | 284 | 374 |
| 2022 | 306 | 297 |
| 2023 | 288 | 216 |
| 2024 | 252 | 227 |
| 2025 | 150 | 203 |
| 2026 | 72 | 81 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
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- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014