Package substrate with a mold extension and die height equalization

A method, comprising:

• forming a pillar on a surface of a substrate;
• attaching a component to the surface of the substrate;
• forming a first mold layer over the surface of the substrate, wherein the first mold layer embeds the pillar and the component;
• recessing the first mold layer to expose the pillar;
• attaching a die to the first mold layer, wherein the die is coupled to the pillar and the component;
• forming a second mold layer over the die;
• and
• recessing the second mold layer to expose a surface of the die.

An apparatus, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a substrate;
• a first plurality of pillars over a surface of the substrate;
• a component on the package substrate;
• a first mold layer around the first plurality of pillars and the component;
• a second plurality of pillars coupled to the first plurality of pillars;
• and
• a second mold layer around the second plurality of pillars and the component;
• a first die coupled to the package substrate, wherein the first die is coupled to at least one of the first plurality of pillars;
• and
• a second die coupled to the package substrate, wherein the second die is coupled to at least one of the first plurality of pillars, and wherein a first backside surface of the first die that faces away from the substrate is substantially coplanar with a second backside surface of the second die that faces away from the package substrate.