H10W 72/242
Relative to the surface
Official title: {relative to the surface, e.g. recessed, protruding}
H10W72/242 (Relative to the surface) appears on 4,323 US grants and 5,036 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,323
- Published applications
- 5,036
- Assignees
- 656
- Inventors
- 6,007
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 12 | 0 |
| 1999 | 25 | 0 |
| 2000 | 24 | 0 |
| 2001 | 54 | 29 |
| 2002 | 59 | 68 |
| 2003 | 76 | 98 |
| 2004 | 65 | 89 |
| 2005 | 75 | 115 |
| 2006 | 51 | 103 |
| 2007 | 71 | 115 |
| 2008 | 74 | 154 |
| 2009 | 69 | 165 |
| 2010 | 110 | 174 |
| 2011 | 144 | 193 |
| 2012 | 162 | 237 |
| 2013 | 221 | 315 |
| 2014 | 261 | 320 |
| 2015 | 321 | 425 |
| 2016 | 348 | 276 |
| 2017 | 320 | 317 |
| 2018 | 270 | 248 |
| 2019 | 248 | 240 |
| 2020 | 233 | 291 |
| 2021 | 210 | 258 |
| 2022 | 212 | 233 |
| 2023 | 197 | 146 |
| 2024 | 171 | 176 |
| 2025 | 125 | 178 |
| 2026 | 75 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof22 Sep 2026US 12,745,458 B2Samsung Display Co., Ltd.
- Memory device and method of assembling same22 Sep 2026US 12,745,632 B2SanDisk Technologies LLC
- Integrated device comprising stacked inductors with low or no mutual inductance15 Sep 2026US 12,740,406 B2QUALCOMM Incorporated
- Semiconductor devices with photonic interconnect platforms and crossbar switches8 Oct 2026US 2026/0309948 A1
- Layer-by-layer formation of through-substrate via8 Oct 2026US 2026/0314369 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells1 Oct 2026US 2026/0303097 A1iCometrue Company Ltd.
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Interconnect structure for wafer level package596US 8,829,676 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same497US 6,887,769 B2Intel Corporation · 2005