H10W 72/231
Shapes
Official title: {Shapes}
H10W72/231 (Shapes) appears on 3,276 US grants and 3,901 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,276
- Published applications
- 3,901
- Assignees
- 639
- Inventors
- 5,418
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 10 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 12 | 0 |
| 1997 | 6 | 0 |
| 1998 | 14 | 0 |
| 1999 | 21 | 0 |
| 2000 | 24 | 0 |
| 2001 | 29 | 33 |
| 2002 | 41 | 41 |
| 2003 | 35 | 31 |
| 2004 | 29 | 50 |
| 2005 | 32 | 67 |
| 2006 | 35 | 69 |
| 2007 | 39 | 74 |
| 2008 | 47 | 93 |
| 2009 | 39 | 86 |
| 2010 | 68 | 77 |
| 2011 | 74 | 103 |
| 2012 | 75 | 135 |
| 2013 | 112 | 199 |
| 2014 | 147 | 233 |
| 2015 | 212 | 330 |
| 2016 | 296 | 269 |
| 2017 | 287 | 266 |
| 2018 | 240 | 189 |
| 2019 | 206 | 235 |
| 2020 | 199 | 249 |
| 2021 | 180 | 241 |
| 2022 | 197 | 200 |
| 2023 | 188 | 180 |
| 2024 | 160 | 199 |
| 2025 | 120 | 150 |
| 2026 | 75 | 102 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Single backside power plane for improved power delivery6 Oct 2026US 12,757,716 B2International Business Machines Corporation
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Multi-wafer bonding for nand scaling1 Oct 2026US 2026/0305424 A1SanDisk Technologies LLC
Most cited
By later US patents
- TSV structures and methods for forming the same396US 8,803,316 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001