H10W 72/235
Of outermost layers of multilayered bumps
Official title: {of outermost layers of multilayered bumps, e.g. bump coating not being conformal on a bump core}
H10W72/235 (Of outermost layers of multilayered bumps) appears on 104 US grants and 155 published applications in this corpus.
Search patents in H10W- Granted patents
- 104
- Published applications
- 155
- Assignees
- 68
- Inventors
- 282
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 2 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 0 |
| 2006 | 1 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 3 |
| 2010 | 2 | 1 |
| 2011 | 3 | 8 |
| 2012 | 1 | 3 |
| 2013 | 7 | 6 |
| 2014 | 1 | 9 |
| 2015 | 5 | 10 |
| 2016 | 10 | 8 |
| 2017 | 8 | 10 |
| 2018 | 12 | 5 |
| 2019 | 6 | 9 |
| 2020 | 6 | 6 |
| 2021 | 7 | 9 |
| 2022 | 6 | 9 |
| 2023 | 6 | 16 |
| 2024 | 9 | 12 |
| 2025 | 8 | 14 |
| 2026 | 3 | 11 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and manufacturing method thereof7 Jul 2026US 12,677,698 B2Kioxia Corporation
- Half-buried electrical connection insert rod device28 Apr 2026US 12,616,054 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Flip chip bonding method and chip used therein24 Mar 2026US 12,588,541 B2Chipbond Technology Corporation
- Copper pillar bump structure and method of manufacturing the same25 Nov 2025US 12,482,777 B2United Microelectronics Corp.
- Semiconductor device and manufacturing method thereof4 Nov 2025US 12,463,108 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Light emitting module and light system including the same10 Sep 2026US 2026/0271471 A1Seoul Viosys Co., Ltd.
- Joining layer and joining structure20 Aug 2026US 2026/0248015 A1TDK Corporation
- Copper bumps on copper pads in semiconductor interconnect structures and methods for forming the same9 Jul 2026US 2026/0198361 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Conductive contacts having varying widths and method of manufacturing same19US 9,105,530 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Cu pillar bump with non-metal sidewall protection structure16US 8,441,124 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Probe for semiconductor devices14US 7,084,656 B1FormFactor, Inc. · 2006
- Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration11US 8,963,326 B2STATS ChipPAC, Ltd. · 2015
- Semiconductor package10US 9,887,176 B22018