Copper pillar bump structure and method of manufacturing the same
AssigneeUnited Microelectronics Corp.
InventorsChen-Hsiao Wang, Kai-Kuang Ho
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Abstract
A copper pillar bump (CPB) structure is provided in the present invention, including a substrate, a pad on the substrate, a passivation layer covering the substrate and exposing the pad, and a copper pillar on the passivation layer and the pad and connecting directly with the pad. The copper pillar is provided with an upper part and a lower part, and a top surface of the lower part includes a first top surface and a second top surface. The second top surface is on one side of the first top surface, and the upper part of the copper pillar is on the first top surface of the lower part. A metal bump is on the copper pillar, wherein parts of the metal bump directly contact the second top surface of the lower part.
Claims6
A copper pillar bump structure, comprising:
- a substrate;
- a bonding pad on said substrate;
- a passivation layer covering said substrate and exposing said bonding pad;
- a copper pillar on said passivation layer and said bonding pad and connecting directly with said bonding pad, wherein said copper pillar is provided with an upper part and a lower part, an upper surface of said lower part is provided with a first upper surface and a second upper surface, and said second upper surface is at one side of said first upper surface, and said upper part of said copper pillar is on said first upper surface of said lower part;
- and
- a metal bump on said copper pillar, wherein parts of said metal bump directly contact said second upper surface of said lower part of said copper pillar.
Dependencies are inferred from the claim text.