Probe for semiconductor devices
AssigneeFormFactor, Inc.
InventorsIgor Y. Khandros, Gaetan L. Mathieu
Life of this patent
Estimating the term…
Abstract
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
Claims24
An electronic assembly comprising:
- a substrate having at least one contact pad;
- and
- a spring contact structure comprising:
- a conductive, flexible, elongate element secured at a first end to said contact pad, said elongate element comprising a first material,
- a shell coating said elongate element, said shell comprising a material that is harder than said first material,
- a dielectric layer formed on at least a portion of said shell, and
- a metal layer formed on at least a portion of said dielectric layer.
An electronic assembly comprising:
- a substrate having at least one contact pad;
- and
- a spring contact structure comprising:
- a conductive, flexible, elongate element secured at a first end to said contact pad, said elongate element comprising a first material,
- a shell coating said elongate element, said shell comprising a material that is harder than said first material,
- a dielectric layer formed on at least a portion of said shell, and
- a conductive layer formed on at least a portion of said dielectric layer.
Dependencies are inferred from the claim text.