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US 2026/0248015 A1Published application
Joining layer and joining structure
AssigneeTDK Corporation
InventorsTomohisa MITOSE, Susumu TANIGUCHI
Life of this patent
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Abstract
A joining layer is a joining layer for joining an electronic component and a substrate electrode, and the joining layer has a width narrower than a width of the substrate electrode at least at a joint portion with the substrate electrode.
Claims6
A joining layer for joining an electronic component and a substrate electrode, wherein the joining layer has a width narrower than a width of the substrate electrode at least at a joint portion with the substrate electrode.
A joining structure for joining an electronic component and a substrate,
- the joining structure comprising:
- a first joining layer joining the electronic component and a first substrate electrode;
- and
- a second joining layer arranged adjacent to the first joining layer and spaced apart from the first joining layer in a width direction, the second joining layer joining the electronic component and a second substrate electrode,
- wherein at least one of the first joining layer and the second joining layer is, at a joint portion with one of the substrate electrodes, arranged at a position spaced further apart from the other joining layer than the substrate electrode corresponding thereof in the width direction.
2 more elements
Dependencies are inferred from the claim text.