H10W 72/234
Cross-sectional shape, i.e. in side view
Official title: {Cross-sectional shape, i.e. in side view}
H10W72/234 (Cross-sectional shape, i.e. in side view) appears on 1,880 US grants and 2,245 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,880
- Published applications
- 2,245
- Assignees
- 443
- Inventors
- 3,366
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 9 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 10 | 0 |
| 1999 | 14 | 0 |
| 2000 | 17 | 0 |
| 2001 | 22 | 15 |
| 2002 | 20 | 24 |
| 2003 | 17 | 18 |
| 2004 | 20 | 24 |
| 2005 | 13 | 37 |
| 2006 | 19 | 35 |
| 2007 | 23 | 38 |
| 2008 | 24 | 58 |
| 2009 | 21 | 47 |
| 2010 | 37 | 40 |
| 2011 | 38 | 54 |
| 2012 | 38 | 81 |
| 2013 | 63 | 98 |
| 2014 | 75 | 140 |
| 2015 | 114 | 187 |
| 2016 | 174 | 167 |
| 2017 | 173 | 173 |
| 2018 | 159 | 120 |
| 2019 | 110 | 135 |
| 2020 | 115 | 126 |
| 2021 | 105 | 139 |
| 2022 | 106 | 104 |
| 2023 | 92 | 117 |
| 2024 | 100 | 112 |
| 2025 | 75 | 84 |
| 2026 | 43 | 72 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001
- Semiconductor integrated circuit chip-to-chip interconnection scheme256US 4,937,653 AAmerican Telephone and Telegraph Company · 1990
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989