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OwnerDamien CHALAVOUX, Bertrand LEVERRIER +1inventors
InventorsDamien CHALAVOUX, Bertrand LEVERRIER, Serge PARBAUD
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A microelectronic assembly includes a microelectronic component, a support and a set of attachment members fixing together the microelectronic component on the support, each attachment member including a conductive bead fixed to the microelectronic component by a first adhesion material and to the support by a second adhesion material, such that, for at least one of the attachment members, a central area of the surface of the conductive bead considered along an axis transverse to the assembly is bare or partially or totally covered by a layer of the first adhesion material and/or a layer of the second adhesion material having a respective thickness of at most 10 nm.
A microelectronic assembly comprising a microelectronic component, a carrier and a set of attachment members bonding the microelectronic component to the carrier, each attachment member comprising a conductive ball bonded to the microelectronic component by a first adhesion material and to the carrier by a second adhesion material, wherein for at least one of the attachment members a central zone of the surface of the conductive ball considered along an axis transverse to the assembly is bare or partially or completely covered by a layer of the first adhesion material and/or a layer of the second adhesion material with a respective thickness of not more than 10 nm.
Dependencies are inferred from the claim text.