H10W 72/237
Multiple bump connectors having different shapes
Official title: {Multiple bump connectors having different shapes}
H10W72/237 (Multiple bump connectors having different shapes) appears on 769 US grants and 925 published applications in this corpus.
Search patents in H10W- Granted patents
- 769
- Published applications
- 925
- Assignees
- 235
- Inventors
- 1,710
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 8 | 18 |
| 2002 | 18 | 11 |
| 2003 | 17 | 8 |
| 2004 | 3 | 16 |
| 2005 | 13 | 22 |
| 2006 | 6 | 14 |
| 2007 | 15 | 13 |
| 2008 | 15 | 23 |
| 2009 | 9 | 14 |
| 2010 | 15 | 17 |
| 2011 | 13 | 15 |
| 2012 | 18 | 30 |
| 2013 | 26 | 44 |
| 2014 | 37 | 63 |
| 2015 | 40 | 69 |
| 2016 | 58 | 55 |
| 2017 | 63 | 48 |
| 2018 | 49 | 46 |
| 2019 | 43 | 48 |
| 2020 | 46 | 70 |
| 2021 | 42 | 65 |
| 2022 | 61 | 65 |
| 2023 | 52 | 38 |
| 2024 | 40 | 47 |
| 2025 | 32 | 49 |
| 2026 | 11 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Double-side-cooling power module29 Sep 2026US 12,751,337 B2Monolithic Power Systems, Inc.
- Microelectronic assemblies with direct bonding using nanotwinned copper15 Sep 2026US 12,740,454 B2Intel Corporation
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Electronic device and a method for making the same30 Jul 2026US 2026/0223753 A1STATS ChipPAC Management Pte. Ltd.
- Hybird bump structures2 Jul 2026US 2026/0191074 A1
- Bottom-up plating of through-glass vias18 Jun 2026US 2026/0173267 A1Intel Corporation
Most cited
By later US patents
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Power overlay chip scale packages for discrete power devices169US 6,306,680 B1General Electric Company · 2001
- Semiconductor device and process for producing the same163US 4,764,804 AHitachi, Ltd. · 1988
- Method of making and using lithographic contact springs151US 6,268,015 B1FormFactor, Inc. · 2001
- Rolling ball connector149US 6,358,627 B2International Business Machines Corporation · 2002