Hybird bump structures

A bump structure, comprising:

• a base portion;
• a plurality of pillar portions on the base portion;
• and
• a plurality of solder portions attached to the plurality of pillar portions.

A semiconductor package, comprising:

• a semiconductor die, comprising a first bump structure, wherein the first bump structure comprises a pillar portion and a solder portion attached to the pillar portion, and wherein the first bump structure is coupled to a signal pin of the semiconductor die, and a second bump structure, wherein the second bump structure comprises a base portion, a plurality of pillar portions on the base portion, and a plurality of solder portions attached to the plurality of pillar portions, and wherein the second bump structure is coupled to a power pin of the semiconductor die;
• a leadframe coupled to the semiconductor die;
• and
• a mold compound covering the semiconductor die and the leadframe.

A method of forming a bump structure on a semiconductor die, comprising:

• providing the semiconductor die including a redistribution layer;
• forming a seed layer on the redistribution layer;
• forming a base portion of the bump structure on the seed layer;
• forming a plurality of pillar portions on the base portion;
• and
• attaching a plurality of solder portions to the plurality of pillar portions.