Electronic device and a method for making the same

Abstract

An electronic device and a method for forming the same are provided. The electronic device comprises: a first substrate; a plurality of electronic components mounted on the first substrate; a plurality sets of conductive structures, wherein each set of conductive structures are formed on and electrically connected with one of the plurality of electronic components such that respective top surfaces of the plurality sets of conductive structures are flush with each other; and a second substrate having a plurality sets of conductive pads formed thereon, wherein each set of conductive pads are mounted on one set of the plurality sets of conductive structures via a set of solder bumps, such that the second substrate is mounted with and electrically connected with the first substrate via the plurality of electronic components, the plurality sets of conductive structures and the plurality sets of conductive pads.

Dependencies are inferred from the claim text.