Double-side-cooling power module

A power module, comprising:

• a device substrate having a first surface and a second surface opposite to the first surface;
• and
• an inductor assembly arranged on the device substrate,
• wherein the device substrate comprises:
• at least one power device chip embedded within the device substrate;
• and
• at least one pair of connecting pillars embedded within the device substrate, wherein the at least one pair of connecting pillars comprises a first connecting pillar and a second connecting pillar arranged at opposite sides of the at least one power device chip;
• wherein
• the at least one power device chip has a first surface covered by a top heat layer exposed on the first surface of the device substrate, and a second surface comprising a plurality of pins exposed on the second surface of the device substrate, and wherein the first surface and the second surface of the at least one power device chip are opposite,
• and wherein the inductor assembly comprises:
• a magnetic core having a first surface and a second surface opposite to the first surface of the magnetic core;
• and
• at least one winding passing through the magnetic core, wherein the at least one winding has a first portion, a second portion and a middle portion connecting the first portion and the second portion, wherein the first portion and the second portion of the at least one winding are vertical to the first surface of the magnetic core, and the middle portion of the at least one winding is parallel to the first surface of the magnetic core, and wherein the first portion and the second portion of the at least one winding respectively has an end connected out of the second surface of the magnetic core.