H10W 72/232
Plan-view shape, i.e. in top view
Official title: {Plan-view shape, i.e. in top view}
H10W72/232 (Plan-view shape, i.e. in top view) appears on 1,333 US grants and 1,609 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,333
- Published applications
- 1,609
- Assignees
- 359
- Inventors
- 2,493
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 4 |
| 2002 | 2 | 5 |
| 2003 | 3 | 2 |
| 2004 | 5 | 11 |
| 2005 | 5 | 14 |
| 2006 | 13 | 28 |
| 2007 | 9 | 27 |
| 2008 | 14 | 26 |
| 2009 | 12 | 31 |
| 2010 | 23 | 32 |
| 2011 | 27 | 27 |
| 2012 | 25 | 44 |
| 2013 | 41 | 90 |
| 2014 | 64 | 84 |
| 2015 | 85 | 158 |
| 2016 | 136 | 130 |
| 2017 | 138 | 129 |
| 2018 | 106 | 93 |
| 2019 | 98 | 106 |
| 2020 | 104 | 118 |
| 2021 | 83 | 104 |
| 2022 | 83 | 88 |
| 2023 | 81 | 76 |
| 2024 | 77 | 88 |
| 2025 | 54 | 65 |
| 2026 | 33 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Double-side-cooling power module29 Sep 2026US 12,751,337 B2Monolithic Power Systems, Inc.
- Stress mitigating pillar bumps15 Sep 2026US 12,740,467 B2QUALCOMM Incorporated
- Integrated circuit package heat sink8 Sep 2026US 12,733,492 B2STMicroelectronics (Grenoble 2) SAS
- Semiconductor structure1 Sep 2026US 12,727,504 B2Win Semiconductors Corp.
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Multi-wafer bonding for nand scaling1 Oct 2026US 2026/0305424 A1SanDisk Technologies LLC
- Manufacture of electronic chips24 Sep 2026US 2026/0293781 A1STMicroelectronics (Tours) SAS
- Package comprising elongated landing pad interconnects and/or elongated pillar interconnects17 Sep 2026US 2026/0282963 A1QUALCOMM Incorporated
Most cited
By later US patents
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001
- Method of making and using lithographic contact springs151US 6,268,015 B1FormFactor, Inc. · 2001
- Substrates with transferable chiplets141US 8,934,259 B2Semprius, Inc. · 2015