Semiconductor structure
AssigneeWin Semiconductors Corp.
InventorsShao-Yu Tu, She-Hsin Hsiao, Jung-Tao Chung
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Abstract
A semiconductor structure includes heterojunction bipolar transistors arranged in parallel and disposed on a substrate. The semiconductor structure also includes a landing structure disposed at the edge of the HBTs on the substrate. The semiconductor structure also includes wiring disposed on the HBTs and connected to the landing structure. The semiconductor structure also includes an insulating layer disposed on the landing structure and having a via. The semiconductor structure also includes a bump disposed on the top surface of the insulating layer and connected to the wiring through the via. The sidewall of the landing structure has a recess in a top view.
Claims20
A semiconductor structure, comprising:
- a plurality of heterojunction bipolar transistors (HBT) arranged in parallel and disposed on a substrate;
- a landing structure disposed at the edge of the HBTs on the substrate;
- wiring disposed on the HBTs and connected to the landing structure;
- an insulating layer disposed on the landing structure and having a via;
- a bump disposed on the top surface of the insulating layer and connected to the wiring through the via,
- wherein a sidewall of the landing structure has a recess in a top view.
A semiconductor structure, comprising:
- a plurality of HBTs disposed on a substrate;
- wiring disposed on the HBTs;
- a landing structure disposed beside the HBTs on the substrate;
- a bump disposed on the wiring and the landing structure;
- an insulating layer covering a sidewall and a portion of the top surface of the landing structure,
- wherein the landing structure has a curved surface in top view.
A semiconductor structure, comprising:
- a plurality of HBTs disposed on the substrate;
- a first dielectric layer deposited on the HBTs and the substrate;
- a landing structure disposed on the first dielectric layer;
- an insulating layer disposed between the HBTs and the landing structure on the substrate;
- wiring disposed on the HBTs;
- and
- a bump disposed over the wiring and the landing structure,
- wherein a bottom surface of the landing structure is lower than a bottom surface of the wiring.
Dependencies are inferred from the claim text.