Package comprising elongated landing pad interconnects and/or elongated pillar interconnects

Abstract

A package comprising a substrate comprising at least one dielectric layer; and a plurality of interconnects comprising: a first plurality of landing pad interconnects, wherein at least one landing pad interconnect from the first plurality of landing pad interconnects has an elongated planar shape; and a second plurality of landing pad interconnects, wherein at least one landing pad interconnect from the second plurality of landing pad interconnects has an elongated planar shape; and an integrated device coupled to the first plurality of landing pad interconnects and the second plurality of landing pad interconnects.

Dependencies are inferred from the claim text.