Stress mitigating pillar bumps

An integrated device comprising:

• a substrate comprising a plurality of contacts;
• a die comprising integrated circuitry electrically connected to the plurality of contacts via a plurality of pillar bumps, the plurality of pillar bumps comprising:
• at least one first pillar bump including:
• a first pillar having a first pillar height;
• and
• a first solder cap having a first solder cap height;
• and
• at least one second pillar bump including:
• a second pillar having a second pillar height, wherein the second pillar height is greater than the first pillar height;
• and
• a second solder cap having a second solder cap height, wherein the second solder cap height is less than the first solder cap height;
• and
• a fill material disposed in a region between the die and the substrate.

A method for fabricating an integrated device, the method comprising:

• electrically connecting at least one first pillar bump of a die to a first contact of a substrate, wherein the first pillar bump includes a first pillar having a first pillar height and a first solder cap having a first solder cap height;
• and
• electrically connecting at least one second pillar bump of the die to a second contact of the substrate, wherein the second pillar bump includes a second pillar having a second pillar height and a second solder cap having a second solder cap height, and wherein the second pillar height is greater than the first pillar height and the second solder cap height is less than the first solder cap height;
• disposing a fill material in a region between the die and the substrate.

A method for fabricating an integrated device, the method comprising:

• forming, on a first contact of a die, a first pillar having a first pillar height;
• forming, on the first pillar, a first solder cap having a first solder cap height;
• forming, on a second contact of the die, a second pillar having a second pillar height, wherein the second pillar height is greater than the first pillar height;
• forming, on the second pillar, a second solder cap having a second solder cap height, wherein the second solder cap height is less than the first solder cap height;
• and
• forming a fill material in a region between the die and a substrate.