Metal pillar for conductive connection
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsEun Dong Jin, Lee Hyunkyu, Kim Kyung Tae, Bae Sung Moon, Park Eun Kwang, Seong Taek Kim, Kim Jin-Gyu, Chu Yongcheol, Oh Heebong
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Abstract
An aspect of the present invention provides a metal pillar in a columnar shape formed by cutting a metal wire to a predetermined length. The metal pillar has a burr length of 0.1 to 0.5 μm on the cutting surface, an electrical conductivity of 11 to 101% IACS, and a Vickers hardness of 150 to 300 HV.
Claims8
A metal pillar for electrically connecting an electrode or a pad of a substrate to an electrode or a pad of a semiconductor chip in a semiconductor package, formed into a column-shaped metal pillar of a certain length by cutting a metal wire, wherein the metal pillar has a burr length of 0.1 to 0.5 μm on a cut surface of the metal pillar, an electrical conductivity of 11 to 101% IACS, and a thermal conductivity of 50 to 450 W/mK.
Dependencies are inferred from the claim text.