H10W 72/251
Materials
Official title: {Materials}
H10W72/251 (Materials) appears on 19,329 US grants and 21,562 published applications in this corpus.
Search patents in H10W- Granted patents
- 19,329
- Published applications
- 21,562
- Assignees
- 2,089
- Inventors
- 21,441
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 14 | 0 |
| 1978 | 7 | 0 |
| 1979 | 7 | 0 |
| 1980 | 8 | 0 |
| 1981 | 10 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 11 | 0 |
| 1988 | 12 | 0 |
| 1989 | 27 | 0 |
| 1990 | 33 | 0 |
| 1991 | 37 | 0 |
| 1992 | 45 | 0 |
| 1993 | 43 | 0 |
| 1994 | 58 | 0 |
| 1995 | 65 | 0 |
| 1996 | 91 | 0 |
| 1997 | 91 | 0 |
| 1998 | 151 | 0 |
| 1999 | 215 | 0 |
| 2000 | 251 | 0 |
| 2001 | 375 | 205 |
| 2002 | 413 | 500 |
| 2003 | 447 | 492 |
| 2004 | 424 | 569 |
| 2005 | 401 | 669 |
| 2006 | 403 | 624 |
| 2007 | 386 | 740 |
| 2008 | 408 | 710 |
| 2009 | 412 | 686 |
| 2010 | 526 | 621 |
| 2011 | 600 | 730 |
| 2012 | 600 | 858 |
| 2013 | 760 | 1008 |
| 2014 | 861 | 1050 |
| 2015 | 958 | 1211 |
| 2016 | 1107 | 1064 |
| 2017 | 1083 | 1077 |
| 2018 | 1002 | 1057 |
| 2019 | 1051 | 1312 |
| 2020 | 1157 | 1471 |
| 2021 | 1016 | 1320 |
| 2022 | 1052 | 1058 |
| 2023 | 988 | 727 |
| 2024 | 799 | 778 |
| 2025 | 604 | 605 |
| 2026 | 287 | 420 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device and semiconductor device fabrication method6 Oct 2026US 12,757,726 B2Lapis Semiconductor Co., Ltd.
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015