H10W 72/257
Multiple bump connectors having different materials
Official title: {Multiple bump connectors having different materials}
H10W72/257 (Multiple bump connectors having different materials) appears on 253 US grants and 313 published applications in this corpus.
Search patents in H10W- Granted patents
- 253
- Published applications
- 313
- Assignees
- 110
- Inventors
- 656
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 2 |
| 2003 | 2 | 6 |
| 2004 | 2 | 3 |
| 2005 | 6 | 4 |
| 2006 | 4 | 8 |
| 2007 | 2 | 2 |
| 2008 | 5 | 10 |
| 2009 | 4 | 8 |
| 2010 | 6 | 10 |
| 2011 | 5 | 9 |
| 2012 | 7 | 12 |
| 2013 | 13 | 10 |
| 2014 | 16 | 26 |
| 2015 | 13 | 22 |
| 2016 | 18 | 17 |
| 2017 | 19 | 21 |
| 2018 | 25 | 18 |
| 2019 | 15 | 12 |
| 2020 | 10 | 22 |
| 2021 | 10 | 20 |
| 2022 | 17 | 20 |
| 2023 | 18 | 12 |
| 2024 | 15 | 18 |
| 2025 | 9 | 13 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device24 Feb 2026US 12,564,082 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Interconnect with low-temperature solder cap6 Aug 2026US 2026/0231807 A1Intel Corporation
- Semiconductor package and fabricating method thereof30 Jul 2026US 2026/0223740 A1Amkor Technology Singapore Holding Pte.Ltd.
- Bonding through multi-shot laser reflow25 Jun 2026US 2026/0182427 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing the same23 Apr 2026US 2026/0114300 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Low cost chip size package and method of fabricating the same204US 6,181,569 B22001
- Stacked packages151US 6,977,440 B2Tessera, Inc. · 2005
- Method for forming solder bump interconnections to a solder-plated circuit trace100US 5,186,383 AMotorola, Inc. · 1993
- Semiconductor device and method of fabricating the same96US 6,573,598 B2Oki Electric Industry Co., Ltd. · 2003
- Low cost chip size package and method of fabricating the same82US 6,350,668 B12002