Bonding through multi-shot laser reflow

A method comprising:

• placing a device die on a package substrate;
• aligning a center of an energy beam to a first position of the device die;
• performing a first energy shot using the energy beam when the center of the energy beam is aligned to the first position;
• shifting the center of the energy beam to a second position of the device die;
• and
• performing a second energy shot using the energy beam when the center of the energy beam is aligned to the second position.

A method comprising:

• placing a device die on a package substrate;
• performing a first laser shot to a first part of the device die, wherein a first solder region between the device die and the package substrate is reflowed;
• shifting a laser beam used for the first laser shot to a second part of the device die having a lower temperature than the first part;
• and
• performing a second laser shot, wherein a second solder region between the device die and the package substrate is reflowed by the second laser shot, and wherein when the second solder region is reflowed, the first solder region remains solid.