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US 2026/0223740 A1Published application
Semiconductor package and fabricating method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsDavid Hiner, Michael Kelly, Ronald Huemoeller, In Su Mok, Sang Hyoun Lee, Won Chul Do, Jin Young Khim, Gam Han Yong, Min Su Jeong, Ji Hun Lee
Life of this patent
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Abstract
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.
Claims20
An electronic device, comprising:
- a lower substrate comprising a lower substrate top side and a lower substrate bottom side;
- an upper substrate comprising an upper substrate top side and an upper substrate bottom side;
- a first electronic component comprising a bottom side that is coupled to the upper substrate top side;
- a second electronic component comprising a bottom side that is coupled to the upper substrate top side;
- device interconnects that couple the lower substrate top side to the upper substrate bottom side;
- and
- a connect die comprising a connect die body and connect die interconnects passing through the connect die body;
- wherein top sides of the connect die interconnects are coupled to the upper substrate bottom side;
- and
- wherein bottom sides of the connect die interconnects are coupled to the lower substrate top side.
7 more elements
An electronic device, comprising:
- an upper redistribution structure comprising a dielectric structure and a conductive structure;
- a lower redistribution structure comprising a dielectric structure and a conductive structure;
- a first electronic component over the upper redistribution structure, wherein the first electronic component comprises a bottom side coupled to the conductive structure of the upper redistribution structure;
- a second electronic component over the upper redistribution structure, wherein the second electronic component comprises a bottom side coupled to the conductive structure of the upper redistribution structure;
- a connect die between the upper redistribution structure and the lower redistribution structure, wherein the connect die comprises a connect die body and connect die interconnects, and wherein each connect die interconnect passes vertically through the connect die body with its top side coupled to the conductive structure of the upper redistribution structure and with its bottom side coupled to the conductive structure of the lower redistribution structure;
- and
- a lower encapsulant between the upper redistribution structure and the lower redistribution structure, wherein the lower encapsulant laterally surrounds the connect die.
4 more elements
A method, comprising:
- providing a first electronic component and a second electronic component;
- providing an upper substrate comprising a top side coupled to a bottom side of the first electronic component and to a bottom side of the second electronic component;
- providing device interconnects with top sides coupled to a bottom side of the upper substrate;
- providing a connect die comprising a connect die body and connect die interconnects passing through the connect die body, wherein top sides of the connect die interconnects are coupled to the bottom side of the upper substrate;
- and
- providing a lower substrate with a lower substrate top side coupled to bottom sides of the connect die interconnects and lower sides of the device interconnects.
3 more elements
Dependencies are inferred from the claim text.