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US 12,588,560 B2Granted
Semiconductor package and fabricating method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsDavid Hiner, Michael Kelly, Ronald Huemoeller, In Su Mok, Sang Hyoun Lee, Won Chul Do, Jin Young Khim, Gam Han Yong, Min Su Jeong, Ji Hun Lee
Life of this patent
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Abstract
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.
Claims20
An electronic device comprising:
- a lower substrate comprising a lower substrate top side and a lower substrate bottom side;
- an upper substrate comprising an upper substrate top side and an upper substrate bottom side;
- a first electronic component comprising a bottom side that is coupled to the upper substrate top side via a first electronic component first interconnect and a first electronic component second interconnect;
- a second electronic component comprising a bottom side that is coupled to the upper substrate top side via a second electronic component first interconnect and a second electronic component second interconnect;
- device interconnects that couple the lower substrate top side to the upper substrate bottom side;
- and
- a connect die comprising a connect die body, a connect die substrate, connect die interconnects passing through the connect die body, and front side interconnects coupled to upper ends of the connect die interconnects;
- wherein the front side interconnects couple the connect die substrate to the upper substrate bottom side;
- and
- wherein the connect die substrate couples the first electronic component to the second electronic component via the first electronic component second interconnect and the second electronic component second interconnect.
7 more elements
An electronic device comprising:
- a lower signal redistribution substrate;
- an upper signal redistribution substrate;
- a first electronic component;
- a second electronic component;
- a first electronic component first interconnect and a first electronic component second interconnect that couple the first electronic component to a top side of the upper signal redistribution substrate;
- a second electronic component first interconnect and a second electronic component second interconnect that couple the second electronic component to the top side of the upper signal redistribution substrate;
- device interconnects that couple:
- the first electronic component to the lower signal redistribution substrate via the first electronic component first interconnect and the upper signal redistribution substrate;
- and
- the second electronic component to the lower signal redistribution substrate via the second electronic component first interconnect and the upper signal redistribution substrate;
- and
- a connect die comprising a connect die body, a connect die substrate, and connect die interconnects passing through the connect die body;
- wherein the connect die interconnects and the connect die substrate are coupled to the upper signal redistribution substrate;
- and
- wherein the connect die substrate couples the first electronic component to the second electronic component via the first electronic component second interconnect, the second electronic component second interconnect, and the upper signal redistribution substrate.
12 more elements
A method of manufacturing an electronic device, the method comprising:
- providing a lower signal redistribution substrate;
- providing an upper signal redistribution substrate;
- providing a first electronic component coupled to a top side of the upper signal redistribution substrate via a first electronic component first interconnect and a first electronic component second interconnect;
- providing a second electronic component coupled to the top side of the upper signal redistribution substrate via a second electronic component first interconnect and a second electronic component second interconnect;
- providing device interconnects that that couple:
- the first electronic component to the lower signal redistribution substrate via the first electronic component first interconnect and the upper signal redistribution substrate;
- and
- the second electronic component to the lower signal redistribution substrate via the second electronic component first interconnect and the upper signal redistribution substrate;
- and
- providing a connect die that comprises a connect die body, a connect die substrate, connect die interconnects passing through the connect die body, and front side interconnects coupled to upper ends of the connect die interconnects;
- wherein the front side interconnects couple the connect die substrate to the upper signal redistribution substrate;
- and
- wherein the connect die substrate couples the first electronic component to the second electronic component via the first electronic component second interconnect, the second electronic component second interconnect, and the upper signal redistribution substrate.
10 more elements
Dependencies are inferred from the claim text.