H10W 72/253
Not comprising solid metals or solid metalloids
Official title: {not comprising solid metals or solid metalloids, e.g. polymers or ceramics}
H10W72/253 (Not comprising solid metals or solid metalloids) appears on 1,170 US grants and 1,297 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,170
- Published applications
- 1,297
- Assignees
- 391
- Inventors
- 2,308
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 15 | 0 |
| 2000 | 17 | 0 |
| 2001 | 16 | 8 |
| 2002 | 18 | 31 |
| 2003 | 19 | 25 |
| 2004 | 18 | 21 |
| 2005 | 17 | 32 |
| 2006 | 23 | 33 |
| 2007 | 23 | 37 |
| 2008 | 29 | 33 |
| 2009 | 26 | 42 |
| 2010 | 28 | 31 |
| 2011 | 29 | 41 |
| 2012 | 40 | 42 |
| 2013 | 41 | 51 |
| 2014 | 34 | 50 |
| 2015 | 40 | 75 |
| 2016 | 51 | 77 |
| 2017 | 82 | 73 |
| 2018 | 79 | 84 |
| 2019 | 67 | 87 |
| 2020 | 94 | 109 |
| 2021 | 69 | 99 |
| 2022 | 88 | 74 |
| 2023 | 68 | 50 |
| 2024 | 56 | 43 |
| 2025 | 47 | 36 |
| 2026 | 10 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device with tiered pillar and manufacturing method thereof30 Apr 2026US 2026/0123448 A1Amkor Technology Singapore Holding Pte.Ltd.
- Integrated circuit package and manufacturing method30 Apr 2026US 2026/0123478 A1STMicroelectronics International N. V.
- Semiconductor package and manufacturing method of the same26 Mar 2026US 2026/0090476 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Packaging of integrated circuits and vertical integration329US 6,693,361 B1Tru-Si Technologies, Inc. · 2004
- Micromachined chip scale package315US 6,072,236 AMicron Technology, Inc. · 2000
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Compressive bump-and-socket interconnection scheme for integrated circuits256US 5,329,423 A1994