H10W 72/252
Comprising solid metals or solid metalloids
Official title: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
H10W72/252 (Comprising solid metals or solid metalloids) appears on 15,783 US grants and 18,294 published applications in this corpus.
Search patents in H10W- Granted patents
- 15,783
- Published applications
- 18,294
- Assignees
- 1,768
- Inventors
- 18,429
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 9 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 8 | 0 |
| 1989 | 16 | 0 |
| 1990 | 18 | 0 |
| 1991 | 21 | 0 |
| 1992 | 27 | 0 |
| 1993 | 33 | 0 |
| 1994 | 43 | 0 |
| 1995 | 38 | 0 |
| 1996 | 46 | 0 |
| 1997 | 53 | 0 |
| 1998 | 85 | 0 |
| 1999 | 126 | 0 |
| 2000 | 126 | 0 |
| 2001 | 190 | 108 |
| 2002 | 209 | 270 |
| 2003 | 227 | 237 |
| 2004 | 217 | 302 |
| 2005 | 188 | 353 |
| 2006 | 215 | 356 |
| 2007 | 205 | 401 |
| 2008 | 204 | 443 |
| 2009 | 238 | 435 |
| 2010 | 330 | 418 |
| 2011 | 373 | 578 |
| 2012 | 421 | 764 |
| 2013 | 616 | 931 |
| 2014 | 753 | 992 |
| 2015 | 909 | 1180 |
| 2016 | 1072 | 1025 |
| 2017 | 1035 | 1046 |
| 2018 | 968 | 1029 |
| 2019 | 1028 | 1289 |
| 2020 | 1126 | 1422 |
| 2021 | 981 | 1274 |
| 2022 | 1016 | 1012 |
| 2023 | 954 | 695 |
| 2024 | 762 | 747 |
| 2025 | 585 | 580 |
| 2026 | 279 | 407 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device and semiconductor device fabrication method6 Oct 2026US 12,757,726 B2Lapis Semiconductor Co., Ltd.
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015