H10W 72/2528
Intermetallic compounds
Official title: {Intermetallic compounds}
H10W72/2528 (Intermetallic compounds) appears on 299 US grants and 389 published applications in this corpus.
Search patents in H10W- Granted patents
- 299
- Published applications
- 389
- Assignees
- 102
- Inventors
- 635
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 0 | 0 |
| 2003 | 3 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 5 |
| 2008 | 1 | 4 |
| 2009 | 2 | 5 |
| 2010 | 3 | 7 |
| 2011 | 5 | 13 |
| 2012 | 8 | 8 |
| 2013 | 10 | 20 |
| 2014 | 13 | 31 |
| 2015 | 26 | 32 |
| 2016 | 26 | 31 |
| 2017 | 34 | 33 |
| 2018 | 24 | 11 |
| 2019 | 19 | 32 |
| 2020 | 19 | 28 |
| 2021 | 18 | 28 |
| 2022 | 29 | 25 |
| 2023 | 16 | 20 |
| 2024 | 22 | 19 |
| 2025 | 11 | 19 |
| 2026 | 7 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding scheme for semiconductor packaging18 Aug 2026US 12,713,957 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device, package structure and method of fabricating the same11 Aug 2026US 12,708,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate21 Jul 2026US 12,690,481 B2Infineon Technologies Austria AG
- Bonding through multi-shot laser reflow17 Mar 2026US 12,581,977 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Structures for low temperature bonding using nanoparticles24 Feb 2026US 12,564,086 B2Adeia Semiconductor Technologies LLC
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Foundry Compatible, Ultra-low Resistance, Under-Bump-Metallization for Electroplated Bumps8 Oct 2026US 2026/0314479 A1
- Connection structure and semiconductor device comprising the same20 Aug 2026US 2026/0248014 A1Samsung Electronics Co., Ltd.
- Joining layer and joining structure20 Aug 2026US 2026/0248015 A1TDK Corporation
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
Most cited
By later US patents
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Nanowire bonding interconnect for fine-pitch microelectronics61US 11,387,202 B2Invensas Corporation · 2022
- Integrated system and method of making the integrated system56US 9,704,843 B2Infineon Technologies AG · 2017
- Semiconductor structures and methods of forming the same55US 10,622,321 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2020
- Multi-layer circuit substrates and electrical assemblies having conductive composition connectors53US 6,054,761 AFujitsu Limited · 2000