Integrated system and method of making the integrated system
AssigneeInfineon Technologies AG
InventorThomas Kilger
Life of this patent
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Abstract
A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.
Claims4
A method for manufacturing an integrated device, the method comprising:
- forming a first reconstitution wafer comprising first components;
- forming a first redistribution line (RDL) layer on the first reconstitution wafer, the first RDL layer providing bonding pads for the first components;
- forming first portions of primary windings and first portions of secondary windings in the first RDL;
- forming a second reconstitution wafer comprising second components;
- forming a second RDL layer on the second reconstitution wafer, the second RDL layer providing bonding pads for the second components;
- forming second portions of the primary windings and second portions of the secondary windings in the second RDL
- dicing the second reconstitution wafer into second encapsulated components, the second encapsulated components comprising the second components, second RDL regions and second bonding pads;
- placing the second encapsulated components on the first RDL layer of the first reconstitution wafer;
- bonding the second bonding pads of the second encapsulated components to the bonding pads for the first components;
- and
- dicing the first reconstitution wafer into integrated devices, each integrated device comprising one of the first encapsulated components and one of the second encapsulated components.
Dependencies are inferred from the claim text.